全球无卤刚性覆铜板的发展现状Development of Worldwide Halogen-free Copper Clad Laminate
张家亮
摘要(Abstract)：
本文介绍了近年来正在逐年扩大的全球无卤刚性覆铜板的市场,无卤刚性覆铜板向高导热的、低传输损失的、无卤无磷阻燃的、无卤封装基板材料四大板材领域发展。分析了松下电工无卤导热覆铜板R-15T1和日立化成无卤高频/高速覆铜板MCL-LW-900G的性能特点。
关键词(KeyWords)： 刚性覆铜板;印制线路板;市场;无卤;导热;低传输损失;无卤无磷阻燃;无卤封装基板;预测;发展
基金项目(Foundation):
作者(Author): 张家亮
DOI: 10.16453/j.issn.2095-8595.2014.01.009
参考文献(References)：
- [1]祝大同.对未来覆铜板技术发展趋势的探讨[J].覆铜板资讯,2010,(6):11-16.
- [2]Christina Jien.A novel halogen-free,phosphorus-free material for PCB applications.Printed Circuit Design&Fab,December 2011.
- [3]Hiikarii Muraii,Yasuyukii Miizuno,Hiiroshii Shiimiizu,Takahiiro Tanabe,Ken IIkeda and Tetsuro IIriino.Low Transmission Loss Multi-layer Material for High-Speed&High-Frequency Applications MCL-FX-2//FX-3.IEEE 2011,Nov 9th.
- [4]Yasuyuki Mizuno.Low Transmission Loss Multilayer PWB Materials for High-Speed and High-Frequency Applications.63rd IEEE ECTC–Las Vegas,NV:May 28–31,2013.
- [5]www.hitachi-chem.co.jp.