骆明珠;康锐;刘法旺;

• 1:工业和信息化部计算机与微电子发展研究中心(中国软件评测中心)
• 2:北京航空航天大学可靠性与系统工程学院

摘要(Abstract)：

本文总结了电子产品可靠性预计从20世纪50年代产生至今60多年的发展历史,对已有的电子产品可靠性预计方法进行了分类,对常用的基于协变量模型和基于故障物理模型的两类重要预计方法分别进行了分析和比较。分析结果表明,针对不同特点、处于不同寿命周期阶段以及具有不同可靠性相关信息的电子产品应选取合适的可靠性预计方法,在更加全面和准确地预计其可靠性水平的同时,消除设计与工艺缺陷,提高其可靠性水平。

关键词(KeyWords)： 可靠性预计;电子产品;协变量模型;故障物理模型

Abstract:

Keywords:

基金项目(Foundation):

作者(Authors): 骆明珠;康锐;刘法旺;

DOI: 10.16453/j.issn.2095-8595.2014.02.001

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• 1 在RADC主持了5届之后,于1967年更名为RPS(Reliability of Physics,可靠性物理),主办方为IEEE电子设备小组和IEEE可靠性小组,现在为IEEE常设的重要学术年会之一,1974年更名为IRPS(International Reliability Physics Symposium,国际可靠性物理论坛)。
• 2 2005年RAC更名为RIAC,Reliability Information Analysis Center
• 3 Centre National d’Etude des Télécommunications
• 4 Direction générale de l’armement,即General Directorate for Armament,法国政府国防采办机构负责法军武器系统的项目管理、开发和采购。DGA委托欧盟的8 个航空与国防领域的机构联合开发了FIDES,这8个机构包括:AIRBUS France,Eurocopter,Nexter Electronics,MBDA Missiles Systems,Thales Services,Thales Airborne Systems,Thales Avionics,Thales Underwater Systems
• 5 International Electrotechnical Commission